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Ladies and Gentlemen,
The last months has passed under the fairs’ issue. Etisoft actively participated in many exhibitions in Poland and abroad, presenting the new products from its offer.
The last months has passed under the fairs’ issue. Etisoft actively participated in many exhibitions in Poland and abroad, presenting the new products from its offer.
We would like to thank all the visitors for attending our stand during PACK FAIR 2011 in Kiev. We have presented the latest solutions of Auto ID and marking system dedicated for the food industry, including Print&Apply devices, which you can read about in the further part of etiNEWS.
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We also would like to thank all the visitors, whom we had opportunity to meet during the Z-2011 Fairs in Leipzig . In Germany, we presented our offer dedicated for automotive and electronics industry.
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In April, we had the occasion to meet our customers at AMPER fairs in Brno. We have presented the latest marking methods dedicated for electronic industry, such as: front panels, PCB labels, rating plates, wiring diagrams and high-resolution labels.
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We were also pleased to welcome our customers in Warsaw during the two exhibitions: easyFairs PACKAGING INNOVATIONS and XVII International Fair for Automation and Measurements AUTOMATICON.
We presented, among other things, Print and Apply systems for marking directly on production lines, described in an article in this newsletter.
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Feel free to read the second issue of etiNEWS and to share your comments with us.
